How additives affect Cu electrodeposition : an electrochemical STM Study

Yanson, Y.I. (2012)

Doctoral Thesis

A study of the effect of chloride and sulfate anions, as well as of SPS molecules on Cu electrodeposition is presented in this thesis. The deposition process was analyzed by means of a home-built fast electrochemical STM in situ after and during deposition.

• Additives
• Copper
• Electrodeposition
• Accelerator
• Chloride
• STM

• All authors: Yanson, Y.I.
• Supervisor: Frenken, J.W.M.
• Co-supervisor: Rost, M.J.
• Committee: Eliel, E.R.; Koper, M.T.M.; Magnussen, O.; Molen, S.J. van der; Wijenberg, J.H.O.J.; Moffat, T.P
• Qualification: Doctor (dr.)
• Awarding Institution: Leiden Institute of Physics (LION), Faculty of Science, Leiden University
• Date: 2012-12-04
• Title of host publication: Casimir PhD Series
• ISBN (print): 9789085931454
• Name: 2012-37
• Court: LEI Universiteit Leiden
• Sponsorship: STW project number 07720